Cube 460
Selective Soldering System
Offers excellent flexibility for all through-hole applications!
Low-cost selective soldering system. This unique batch platform offers excellent flexibility for through- hole applications. The smaller footprint utilizes the same soldering technology found on JUKI's larger platforms while offering a superior ROI of 6-12 months.
The CUBE-460 is the most accessible selective solder machine, allowing for easy setup and easy maintenance.
The solder pot and nozzles are ready for lead-free production.
- • Low Cost
- • Excellent Flexibility
- • Superior ROI
- • Fast programming
- • Easy Setup & Maintenance
FEATURES
Specifications
Item | Cube 460 |
Dimensions with shuttle |
L 2000mm; W 1550mm; H1250mm (78.7” x 61” x 49.2”) |
Weight |
Approximately 800kg (1760 lbs) |
Exhaust opening |
Ø150mm (6”) |
Item | Cube 460 | New Column |
Extraction rate |
400m2 |
|
Power requirements |
32A*, 208VAC 3 Phase, 50/60Hz, 6kW |
|
Item | System Control | Option |
Control concept |
Machine control PC and PLC |
|
UPS |
Optional |
|
PC |
Windows® PC: Flat screen monitor; keyboard; mouse |
|
Off-line software |
Off-line software for easy programming |
|
Camera |
Live process viewing camera |
|
Axis movement |
Servo controlled with high performance belts lead screws |
|
Drive concept |
DC Servo motors with encoders; CAN-BUS |
|
Repeatability |
±0.15mm (±0.006”) |
|
Item | Board Size | Option |
Dimensions min/max |
20mm x 20mm / 460mm x 460mm (0.79” x 0.79” / 18” x 18”) |
|
Soldering angle |
0º or 7º |
|
Bottom side clearance |
30mm (1.2”) |
|
Top side clearance |
150mm (6”) |
|
Carrier |
Universal (2) |
|
Item | Flux System | Option |
Flux head |
Micro-Dot Drop-Jet Spray Fluxer |
|
Flux |
Alcohol based - less than 5% solids recommended (Micro-Dot Drop-Jet) |
|
Flux container |
Alcohol based - less than 26% solids recommended (Spray Fluxer) Second flux pot for different flux type available |
|
Item | Pre-heat | Option |
Type |
Bottom Side - Quartz IR emitters |
|
Power |
4kW |
|
Top side Maintenance/Pre-heater |
Built in over the PCB |
|
Item | Solder Pot | Option |
Alloy |
Tin Lead or Lead Free |
|
Volume lead free |
45 kg |
|
Volume tin lead |
50 kg |
|
Extra mini wave module |
Individual functioning nozzles with different sizes for ultimate flexibility |
|
Standard nozzle |
Ø4mm - Ø20mm (0.15” - 0.79”) |
|
Wetted nozzle |
Ø4mm - Ø20mm (0.15” - 0.79”) |
|
Warm up time |
Approximately 45 minutes |
|
Solder temperature |
Maximum 330ºC |
|
Solder temperature and height |
Program controlled |
|
Solder wire |
Motorized feed, 2mm (0.08”) diameter, max. weight 5 kg (11 lbs) |
|
Nitrogen supply |
Recommended 10 PPM (99.999%) purity Minimum 100 RPM (99.99%) purity |
|
Nitrogen consumption |
Max. 25 liter/minute Single Nozzle/Max. 50 liter/minute Dual Nozzle |
|
Electro-dynamic solder pump |
Alternative to standard rotary drive pump |
|
Wave module-200mm (7.67”) |
Option for a 200mm (7.87”) wide solder wave module |
|
Video
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