Cube 460
Selective Soldering System
Offers excellent flexibility for all through-hole applications!
Low-cost selective soldering system. This unique batch platform offers excellent flexibility for through- hole applications. The smaller footprint utilizes the same soldering technology found on JUKI's larger platforms while offering a superior ROI of 6-12 months.
The CUBE-460 is the most accessible selective solder machine, allowing for easy setup and easy maintenance.
The solder pot and nozzles are ready for lead-free production.
- • Low Cost
- • Excellent Flexibility
- • Superior ROI
- • Fast programming
- • Easy Setup & Maintenance
FEATURES
Specifications
Item | Cube 460 |
Dimensions with shuttle | L 2000mm; W 1550mm; H1250mm (78.7” x 61” x 49.2”) |
Weight | Approximately 800kg (1760 lbs) |
Exhaust opening | Ø150mm (6”) |
Item | Cube 460 | New Column |
Extraction rate | 400m2 | |
Power requirements | 32A*, 208VAC 3 Phase, 50/60Hz, 6kW | |
Item | System Control | Option |
Control concept | Machine control PC and PLC | |
UPS | Optional | |
PC | Windows® PC: Flat screen monitor; keyboard; mouse | |
Off-line software | Off-line software for easy programming | |
Camera | Live process viewing camera | |
Axis movement | Servo controlled with high performance belts lead screws | |
Drive concept | DC Servo motors with encoders; CAN-BUS | |
Repeatability | ±0.15mm (±0.006”) | |
Item | Board Size | Option |
Dimensions min/max | 20mm x 20mm / 460mm x 460mm (0.79” x 0.79” / 18” x 18”) | |
Soldering angle | 0º or 7º | |
Bottom side clearance | 30mm (1.2”) | |
Top side clearance | 150mm (6”) | |
Carrier | Universal (2) | |
Item | Flux System | Option |
Flux head | Micro-Dot Drop-Jet Spray Fluxer | |
Flux | Alcohol based - less than 5% solids recommended (Micro-Dot Drop-Jet) | |
Flux container | Alcohol based - less than 26% solids recommended (Spray Fluxer) Second flux pot for different flux type available | |
Item | Pre-heat | Option |
Type | Bottom Side - Quartz IR emitters | |
Power | 4kW | |
Top side Maintenance/Pre-heater | Built in over the PCB | |
Item | Solder Pot | Option |
Alloy | Tin Lead or Lead Free | |
Volume lead free | 45 kg | |
Volume tin lead | 50 kg | |
Extra mini wave module | Individual functioning nozzles with different sizes for ultimate flexibility | |
Standard nozzle | Ø4mm - Ø20mm (0.15” - 0.79”) | |
Wetted nozzle | Ø4mm - Ø20mm (0.15” - 0.79”) | |
Warm up time | Approximately 45 minutes | |
Solder temperature | Maximum 330ºC | |
Solder temperature and height | Program controlled | |
Solder wire | Motorized feed, 2mm (0.08”) diameter, max. weight 5 kg (11 lbs) | |
Nitrogen supply | Recommended 10 PPM (99.999%) purity Minimum 100 RPM (99.99%) purity | |
Nitrogen consumption | Max. 25 liter/minute Single Nozzle/Max. 50 liter/minute Dual Nozzle | |
Electro-dynamic solder pump | Alternative to standard rotary drive pump | |
Wave module-200mm (7.67”) | Option for a 200mm (7.87”) wide solder wave module | |
Video
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