JM-100
Advanced MI Solution
Achieve higher quality and labor savings by automating manual insertion!
The JM100 automates the manual insertion process and is the advanced model for larger/heavier components and larger boards.
- • Placement or Insertion of Surface Mount & Through-Hole Components
- • Widest Component Range in the Electronics Industry
- • Accommodates Multiple Types of Feeders
FEATURES
*Key Feature*
Active Clinching
The JM100 Multi Task Platform's clinch unit is a sophisticated and precise component designed to enhance the reliability and efficiency of electronic assemblies. This unit effectively bends the lead sections of inserted components, ensuring they remain securely attached to the board. It accommodates various lead pitches from 5 mm to 20 mm and supports lead diameters ranging from 0.45 mm to 1.0 mm.
The clinch method offers flexible options including inward from the outside, outward from the inside, counterclockwise (CCW) rotation, and clockwise (CW) rotation. The unit features a five-axis system: CX and CY axes for horizontal movements, and CZ, CT, and CC axes for vertical claw movements, claw rotation, and claw opening/closing, respectively. This configuration supports precise positioning and secure lead mounting, even for boards up to 410×360 mm in size.
Hybrid SMT and Through Hole Placement Machine
Advanced model for larger/heavier components and larger boards.
6 Nozzles per Gantry (Plus IC head on 3020V)
Can place 6 components simultaneously and center on the fly.
High Accuracy Low Noise Ball Screw Drive
With Linear Encoders.
High Accuracy Laser Align Component Centering
Select centering method based on component type, shape, size and material.
Through Hole Placement
Lead Tip Centering
Lead Orientation Detection
The laser sensor is ideal for lead tip detection leading to improved insertion process.
Bowl Feeders (MBF)
MBF (Fixed), MBF-C (Trolley) or MBF-L (for large components).
Radial Feeders (MRF)
MRF-S/M-L, or snap-in MRF-LF
Specifications
| Item | JM-100 |
| Model | Standard Specification (L size PCB) Clinch specification (L size PCB) When using/not using the clinch unit) |
| Board Size Single clamping Double clamping | 50 x 50 mm～410 x 360 mm 80 x 100 mm～410 x 360 mm 50 x 50 mm～800 x 360 mm 80 x 100 mm～800 x 360 mm |
| PCB weight | Max. 4 kg |
| Component height | Max. 30 mm |
| Component size Laser recognition Vision recognition | 0603～□50 mm □3 mm 78 x 48 mm or 85 x 25 mm |
| Insertion speed (Insertion components) Vacuum nozzle Gripper nozzle | 0.6 sec/part 0.8 sec/part |
| Placement accuracy (SMT) Laser recognition Vision recognition | ±0.05 mm (3o) ±0.04 mm |
| Power supply | 200 to 415V AC 3-phase |
| Apparent power | 1.8kVA |
| Circuit breaker | Standard |
| Operation air pressure | 0.5±0.06MPa |
| Air consumption (standard) | 82L/min |
| Conveyor height | 900 mm ±20 mm |
| Machine dimension (WxDxH) | 1,500 x 1,500 x 1,45 mm |
| Mass (appoximately) | 1,300 kg |
Video
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